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Requirements for PCB Assembly Process Materials

In order to meet the requirements of high quality and high reliability of SMA in circuit boards, what are the main requirements for PCB assembly process materials in the SMT process?


1. Good stability and reliability of solder paste during PCB assembly


PCB assembly requires the solder to strictly control the content of harmful impurities; the solder paste and flux require low residue and non-corrosiveness; the adhesive requires the bonding strength to be neither high nor low to ensure that it does not fall off during the soldering process. It can also be easily removed during maintenance.


2. PCB assembly can meet the needs of high-speed production equipment


The SMT production process is generally a high-speed automated process, and the process materials should be adapted to it, such as the curing time of the bonding system.


In the mid-to-late 1980s, when the PCB was assembled using the oven intermittent curing method, it was about 20 minutes, while the tunnel furnace continuous curing method commonly used in the 1990s required the curing time to be within 5 minutes. Shorter cure time.


3. PCB assembly can meet the needs of fine pin spacing and high-density assembly


Fine pin pitch and high-density assembly require finer particle size of alloy solder powder in solder paste; better thixotropy and lower slump of solder paste and binder; strict control of solid content and activity in flux, In order to avoid bad phenomena such as welding.


4. PCB assembly can meet ROSH environmental protection requirements


Many of the traditional SMT process materials contain substances that are harmful to the atmosphere, the ozone layer, and the human body, such as cleaning agents containing chlorofluorocarbons (CFCs) and lead-containing solders.


With the enhancement of human's awareness of environmental protection and the increasing attention to human health, the research on PCB assembly of harmless SMT process materials is being continuously strengthened.


The current solder is divided into lead-free and lead-containing two types according to the lead content, and lead-containing solder has been gradually replaced by lead-free solder.


The characteristics of lead-free solder are that it reduces the harm of lead to people's living environment, has the advantages of high melting point, superior tensile strength, and strong fatigue resistance, and has higher requirements for the thermal stability of the flux and the welding process and equipment. 


HX Electronic Technology Co.,Ltd is a PCB assembly company and a national high-tech enterprise in China, specializing in PCB assembly services, providing fast, professional and high-quality printed circuit board services.


HX Electronic Technology Co.,Ltd follows ISO production procedures and adopts IPC level 2 quality supervision standards to provide high-quality products. In the scientific spirit of continuous reform and innovation, with advanced production technology and management concepts, HX Electronic Technology is striving to provide global customers with high-quality products and first-class printed circuit board services. Welcome customers from all over the world to visit and consult.

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6th floor, Huachuangda YiJing Building, 45 District, Bao'an District, Shenzhen, China, 518101
david@hx-technology.com
+86-755-23021813