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Manufacturing Process of Bms PCB

Bms PCBs integrate traditional technologies and techniques such as mechanical, electrical, automation, chemical, biological, ERP, cost, management, and environmental protection as a distinctive process product.

Its dependability is crucial. In general, the number of component types necessary for single-species bms PCBs does not surpass the feeder's capacity, while the total number of component types required for multi-species bms PCBs frequently exceeds the feeder's capacity. PCB bms What is the fundamental manufacturing procedure?

Ⅰ. Using photographic boards to cut copper laminates and make bms PCBs

To conserve material, the laminate, which is a circuit board coated on both sides with copper film, is trimmed to the size of the circuit board, not too huge.

Ⅱ. Pre-treatment of bms PCB copper clad board

To guarantee that the transfer of theremin PCB, thermal transfer paper on the toner can be securely printed on the copper-clad board, use fine sandpaper to sand off the surface of the copper-clad board oxide layer. A suitable sanding standard is bms PCB board surface brilliant, no noticeable stains.

Ⅲ. Print and transfer the theremin PCB

The PCB will be printed using transfer paper, with the side of the drawing facing you. Generally, two theremin PCB will be produced, i.e., a paper printed on two theremin PCB.

Cut the printed theremin PCB to size, glue the side with the theremin PCB on the laminate, align it carefully, and then place the laminate in the thermal transfer machine, ensuring sure the transfer paper is not misaligned.

In most cases, the theremin PCB will be firmly transferred onto the laminate after 2-3 transfers. The temperature of the thermal transfer machine has been set at 160-200°C and has been warmed. Due to the extreme temperatures, use caution when operating!

Drilling and pre-processing of bms PCBs

Drilling holes for the circuit board is required since it will be put into the electronic components. The board must be firmly held down when drilling with the drill, and the drill speed must not be too sluggish.

After drilling, sand off the toner on the board with fine sandpaper and rinse it with water. Use rosin to cover the side with lines once the water has dried; to speed up the rosin solidification, we use a hot fan to heat the circuit board; rosin may be solidified in about 2-3 minutes.

Ⅳ. Etch the bms PCB and reflow the machine

Check to see if the theremin PCB is complete; if there are a few spots that aren't adequately transferred, you may patch them with a black oil-based pen.

The bms PCB board will then be taken from the etching solution and cleaned, and the exposed copper layer on the circuit board will be totally corroded off, resulting in a well-etched circuit board.

The corrosion solution is made up of concentrated hydrochloric acid, concentrated hydrogen peroxide, and water in a 1:2:3 ratio. When making corrosion solution, start with water and then add concentrated hydrochloric acid, concentrated hydrogen peroxide. If concentrated hydrochloric acid, concentrated hydrogen peroxide, or corrosion solution accidentally splashes on the skin or clothing, clean it up immediately with water.

After attaching the electronic components of the bms PCB to the board, turn it on.

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