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# High Precision Multi-layer Theremin PCB Processing

With the development of modern electronic technology and the high-speed and integration of chips, the inside and outside electromagnetic environment of various electronic equipment systems has become more complex, so multilayer PCB processing is particularly important.

## 1. Impedance characteristics of the BMS PCB

According to the signal transmission theory, the signal is a function of time and distance variables, so every part of the signal on the connection may change.

Therefore, determine the AC impedance of the connection, that is, the ratio of the change in the voltage of the BMS PCB to the change in the current, as the characteristic impedance of the transmission line (Characteristic Impedance): The characteristic impedance of the transmission line is only related to the characteristics of the signal connection itself.

In the actual circuit, the resistance of the wire itself is smaller than the distributed impedance of the system, especially in the high-frequency circuit, the characteristic impedance mainly depends on the distributed impedance brought by the unit distributed capacitance and unit distributed inductance of the connection. The characteristic impedance of an ideal transmission line only depends on the unit distributed capacitance and unit distributed inductance of the connection.

## 2. The calculation of the impedance of the BMS PCB

The proportional relationship between the rising edge time of the signal and the time required for the signal to be transmitted to the receiving end determines whether the signal connection is regarded as a transmission line. If the length of the wire connection on the BMS PCB is greater than l/b, the connecting wire between the signals can be regarded as a transmission line.

From the signal equivalent impedance calculation formula, the impedance of the transmission line can be expressed by the following formula: In the case of high frequency (tens of megahertz to hundreds of megahertz), wL>R is satisfied (of course, in the range of signal frequency greater than 109Hz, considering the concentration effect of the signal, this relationship needs to be carefully studied).

Then for a certain BMS PCB transmission line, its characteristic impedance is a constant. The reflection phenomenon of the signal is caused by the inconsistency of the characteristic impedance of the driving end of the signal and the transmission line and the impedance of the receiving end.

For CMOS circuits, the output impedance of the signal driving end is relatively small, which is about tens of ohms. The input impedance of the receiving end is relatively large.

## 3. The characteristic impedance control of the BMS PCB

The characteristic impedance of the wires on the BMS PCB board is an important indicator of circuit design. Especially in the PCB design of high-frequency circuits, it is necessary to consider whether the characteristic impedance of the wires is consistent with the characteristic impedance required by the device or signal, and whether they match.

Therefore, there are two concepts that must be paid attention to in the reliability design custom PCB.

There are various signal transmissions in the conductors in the circuit board. When the frequency must be increased in order to increase its transmission rate, if the circuit itself is different due to factors such as etching, stack thickness, wire width, etc., the impedance value will change. Its signal is distorted.

Therefore, the impedance value of the conductor on the high-speed circuit board should be controlled within a certain range, which is called "impedance control".

The main factors that affect the impedance of BMS PCB traces are the width of the copper wire, the thickness of the copper wire, the dielectric constant of the medium, the thickness of the medium, the thickness of the pad, the path of the ground wire, the wiring around the wire, etc.

Therefore, when designing the PCB, the impedance of the traces on the board must be controlled to avoid signal reflection and other electromagnetic interference and signal integrity problems as much as possible, and to ensure the stability of the actual use of the theremin PCB. The calculation method of the impedance of the microstrip line and strip line on the BMS PCB can refer to the corresponding empirical formula.